Olmec’s rugged chassis series offers compact and lightweight solutions for challenging environments. The OLM-410-EC, a 4-slot ATR chassis, is well-suited for EW/ISR and high-speed edge computing in ground and airborne assets. The OLM-510-EC, a 5-slot chassis, combines forced air and conduction cooling for optimal thermal performance. For larger deployments, the OLM-910-EC, a 9-slot ATR chassis, provides durability in harsh conditions. Olmec’s Conduction/Convection cooled Rugged Chassis line ensures reliability across diverse applications, from defense operations to industrial settings.
Olmec offers 3 standard solution for mission critical applications. Besides, we also do take care of the customized solution as per the requirement from our customers.
4 slots
Olmec provides ATR Chassis which may be conduction cooled or an ATR solution. The architecture could be VPX, VME64X,customized and standard solutions. The OLM-410-EC chassis is a rugged packaging solution addressing a wide range of EW / ISR applications as well as high speed edge computing requirements. Its compact and lightweight design is ideal for ground and airborne assets where size constraints and functional performance in demanding environments are key. Designed for 3U VPX and SOSA aligned payload cards supporting high speed connectivity with GbE, 10GbE, RF and optical interfaces.
5 slots
A five slot chassis for 3U VPX and SOSA aligned board payloads is called the OLM-510-EC. Its hybrid cooling architecture extends the thermal performance of commonly available VITA 48.2 conduction cooled modules by combining forced air cooling with conduction cooling. Applications in harsh situations where SWaP limitations meet extreme power demands is the target market for these rugged chassis.
9 slots
With two detachable, large capacity drive ports, the OLM-910-EC is a nine-slot ATR chassis designed for 3U VPX and SOSA aligned modules. The widely accessible VITA 48.2 board sets with total power demands of up to 400W are forced air cooled by the conduction cooled chassis. This durable packaging option is suitable for harsh conditions.